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Engineering Science undergraduates are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem.This collection archives the following assignments: proposal, design specifications, requirements specifications, and final presentation
Author: Hogg, Davis, Author: Srdic, Alek, Author: Lavin, Mark, Author: Kim, Michael, Author: Yang, Martin, Author: DAM3Technologie
Date created: 2022-08-30
Engineering Science undergraduates are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem.This collection archives the following assignments: proposal, design specifications, requirements specifications, and final presentation
Author: Hogg, Davis, Author: Srdic, Alek, Author: Lavin, Mark, Author: Kim, Michael, Author: Yang, Martin, Author: DAM3Technologie
Date created: 2022-08-30
Engineering Science undergraduates are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem.This collection archives the following assignments: proposal, design specifications, requirements specifications, and final presentation
Author: Hogg, Davis, Author: Srdic, Alek, Author: Lavin, Mark, Author: Kim, Michael, Author: Yang, Martin, Author: DAM3Technologie
Date created: 2022-08-30
Engineering Science undergraduates are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem.This collection archives the following assignments: proposal, design specifications, requirements specifications, and final presentation
Author: Hogg, Davis, Author: Srdic, Alek, Author: Lavin, Mark, Author: Kim, Michael, Author: Yang, Martin, Author: DAM3Technologie
Date created: 2022-08-30