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Author (aut): Tay, Daniel, Author (aut): Harms, Victoria, Author (aut): Hillyard, Steven A., Author (aut): McDonald, John J.
Date created: 2019-03-20
Author (aut): Oliveira, Flavio T. P., Author (aut): Hickey, Clayton , Author (aut): McDonald, John J.
Date created: 2014-01-03
Author (aut): Doesburg, Sam M., Author (aut): Green, Jessica J., Author (aut): McDonald, John J., Author (aut): Ward, Lawrence M.
Date created: 2009-07-03
Author (aut): Tay, Daniel, Author (aut): McIntyre, David L., Author (aut): McDonald, John J.
Date created: 2022-10-01
Author (aut): Smit, Andrea N., Author (aut): Michalik, Mateusz, Author (aut): Livingstone, Ashley, Author (aut): Mistlberger, Ralph E., Author (aut): McDonald, John J.
Date created: 2019-10-15
Author (aut): Tay, Daniel, Author (aut): Jannati, Ali, Author (aut): Green, Jessica J., Author (aut): McDonald, John J.
Date created: 2022-01-05
Author (aut): McDonald, John J., Author (aut): Tay, Daniel, Author (aut): Prime, David J., Author (aut): Hillyard, Steven A.
Date created: 2021-04-12
Undergraduate Engineering students are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem. This collection archives the following assignments: proposal, design specifications, requirements specifications, and proof of concept.
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Undergraduate Engineering students are required to complete a group-based, two-course capstone sequence: ENSC 405W and ENSC 440. Groups form company structures and create an innovative product that potentially acts as a solution to a real-life problem. This collection archives the following assignments: proposal, design specifications, requirements specifications, and proof of concept.
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04
Author (aut): Chen, Scott Wei Ting, Author (aut): Cheng, Jacky, Author (aut): Pang, Derek Ching Yin, Author (aut): Wang, Jim, Author (aut): NeoSpectra Technologies Inc.
Date created: 2007-04