A novel self-assembly method is presented for creating self-assembled three-dimensional micro-electro-mechanical systems (MEMS) structures. The residual stress between structural polymer layers caused by separate curing processes has been used as the self-assembly mechanism. Various radii of curvature are presented using this self-assembly method in order to show the capability of fabricating three-dimensional microstructures. SU-8 negative photoresist is used as a structural material, and induced stresses are lithographically defined for self-assembly. The self-assembly mechanism is simulated using finite element analysis in ANSYS. Several types of self-assembled microstructures are presented. The fabrication is performed at low temperatures and is compatible with commercial integrated-circuit processes.
Copyright is held by the author.
The author has not granted permission for the file to be printed nor for the text to be copied and pasted. If you would like a printable copy of this thesis, please contact email@example.com.
Member of collection