Resource type
Thesis type
(Thesis) M.A.Sc.
Date created
2024-12-03
Authors/Contributors
Author: Hajipour, Mohammadreza
Abstract
High-precision applications require stable operating environments for components, with temperature stability often being the most critical requirement. Existing methods for temperature control rely on a combination of device-level (i.e., on-die) and system-level (i.e., on-board and on-enclosure) temperature control and shielding to achieve the necessary temperature stability. However, device-level solutions offer limited post-fabrication flexibility, while board/enclosure-level solutions contribute to increased system bulk and power consumption. A simple and versatile method of using on-package heaters and sensors for temperature control is demonstrated. Various configurations of surface-mount heaters and sensors were examined around a commercially available ceramic package. A simple proportional-integral temperature controller was developed and used for integrated temperature control. The method achieves similar accuracies to having an on-die sensor and is applicable to various high-performance sensing applications. Furthermore, it is shown that sub-mK temperature stability is possible with a power consumption of approximately 500mW.
Document
Extent
88 pages.
Identifier
etd23533
Copyright statement
Copyright is held by the author(s).
Supervisor or Senior Supervisor
Thesis advisor: Bahreyni, Behraad
Language
English
Member of collection
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etd23533.pdf | 37.67 MB |